ASE Technology Holding Co., Ltd. (ASX)

業務介紹

ASE Technology Holding Co., Ltd.（ASE科技控股股份有限公司）在美國、台灣、亞洲其他地區、歐洲和國際市場提供各種半導體封裝測試和電子製造服務。該公司提供封裝服務，包括翻轉芯片球網陣列（BGA）和芯片尺寸封裝（CSP），先進的芯片尺寸封裝，四方平封裝，低輪廓和薄型四方平封裝，凸點芯片載體和無鉛四方平封裝（QFN），先進的QFN封裝，塑料BGA和3D芯片封裝；各種封裝的堆疊芯片解決方案；以及銅線和銀線焊接解決方案。該公司還提供先進的封裝，如翻轉芯片BGA；散熱器FCBGA；翻轉芯片CSP；混合FCCSP；翻轉芯片封裝內封裝和封裝上封裝（POP）；先進的單面基板；高頻寬POP；扇出晶片級封裝；SESUB；和2.5D矽中介層。此外，該公司還提供IC線路焊接封裝；系統級封裝產品（SiP）和模組；互連材料，以及汽車電子產品的組裝。此外，該公司還提供一系列半導體測試服務，包括前端工程測試，晶圓探針測試，邏輯/混合信號/射頻模組和SiP/MEMS/離散最終測試，以及其他測試相關服務，還提供直接發貨服務。此外，該公司開發、建造、銷售、租賃和管理房地產；生產基板；提供信息軟件、設備租賃、投資咨詢和倉儲管理服務；加工和銷售計算機和通信外設、電子元件、電信設備和主機板；進出口商品和技術。該公司成立於1984年，總部位於台灣高雄。

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

公司網址

https://www.aseglobal.com