Amkor Technology, Inc. (AMKR)

業務介紹

Amkor Technology, Inc.（安茂科技股份有限公司）在美國、日本、歐洲、中東、非洲和亞太地區提供外包的半導體封裝和測試服務。該公司提供一站式封裝和測試服務，包括半導體晶圓鍍錫、晶圓探針、晶圓背研磨、封裝設計、封裝和測試以及直接發貨服務。該公司還提供用於智能手機、平板電腦和其他移動消費電子設備的翻轉芯片尺寸封裝產品；用於在移動設備中將記憶體堆疊在數字基頻上方以及應用處理器的翻轉芯片堆疊尺寸封裝；以及用於各種網絡、存儲、計算和消費應用的翻轉芯片球網格陣列封裝。此外，該公司還提供用於功率管理、收發器、傳感器、無線充電、編解碼器、雷達和特殊矽的晶圓級CSP封裝；用於集成電路的晶圓級扇出封裝；以及用較薄結構取代層壓基板的矽晶圓集成扇出技術。此外，該公司還提供用於低至中等引腳數模應用的鉛框封裝；用於將晶片連接到基板的基板線鍵封裝；微機電系統（MEMS）封裝，用於微型化的機械和電機設備；以及用於無線電頻率和前端模塊、基頻、連接性、指紋傳感器、顯示屏和觸摸屏驅動器、傳感器和MEMS以及NAND記憶體和固態硬盤的先進系統封裝模塊。該公司主要為集成器件製造商、無廠半導體公司、原始設備製造商和合同代工廠提供服務。Amkor Technology, Inc.成立於1968年，總部位於亞利桑那州坦佩市。

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

公司網址

https://amkor.com